The complete range of printed circuit coatings which fulfil highest demands in pcb manufacturing
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ELPEPCB® Etch resists, plating resists and Elpemer® photoresists
For the creation of fine and ultra-fine trace images on inner and outer layers; excellent adhesion and high surface hardness
ELPEPCB® Etch resists, plating resists and Elpemer® photoresists
For the creation of fine and ultra-fine trace images on inner and outer layers; excellent adhesion and high surface hardness
ELPEPCB® Etch resists, plating resists and Elpemer® photoresists
For the creation of fine and ultra-fine trace images on inner and outer layers; excellent adhesion and high surface hardness
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Elpemer® photoresists
Excellent resolution, capable of representing ultra-fine traces < 50 µm; very low exposure energy; quick to dry; for all standard application processes; strippable in filterable flakes, promoting reduced waste water contamination and longer standing time of the stripper solution
Plating resist for use in Secondary Imaging Technology (SIT), protects metal surfaces during electroless Ni/Au process (ENiG), thus enabling an additional OSP surface finish
Plating resist for use in Secondary Imaging Technology (SIT), protects metal surfaces during electroless Ni/Au process (ENiG), thus enabling an additional OSP surface finish
Enable simultaneous "complete soldering" and selective soldering, compatible with lead-free soldering processes, for rigid, flex-rigid and flexible pcbs, excellent adhesion
ELPEPCB® Solder resists
Enable simultaneous "complete soldering" and selective soldering, compatible with lead-free soldering processes, for rigid, flex-rigid and flexible pcbs, excellent adhesion
ELPEPCB® Solder resists
Enable simultaneous "complete soldering" and selective soldering, compatible with lead-free soldering processes, for rigid, flex-rigid and flexible pcbs, excellent adhesion
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Photoimageable Elpemer® solder resists
Excellent resolution, capable of representing finest structures (ink dams), for all standard application processes, UL approvals in acc. with UL File No. E80315
Editions 733 and 766
For all standard application processes, aqueous-alkaline developable
For the partial masking of pcbs as protection from direct contact with solder or as protection in electroplating processes, simple/high-definition application by screen printing, very high elasticity and tear resistance, easy to remove before and/or after the soldering process
ELPEPCB® Peelable solder masks
For the partial masking of pcbs as protection from direct contact with solder or as protection in electroplating processes, simple/high-definition application by screen printing, very high elasticity and tear resistance, easy to remove before and/or after the soldering process
ELPEPCB® Peelable solder masks
For the partial masking of pcbs as protection from direct contact with solder or as protection in electroplating processes, simple/high-definition application by screen printing, very high elasticity and tear resistance, easy to remove before and/or after the soldering process
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SD 2950 series
For leaded or lead-free wave and reflow soldering and Hot-Air Levelling, some versions allow multiple soldering
for printing over carbon-conductive ink
peelable from plated-through holes
suitable as masks in electroplating and other metallisation processes
Securely seal via holes for vacuum adaptation during incircuit testing, prevent solder from seeping to the component side and fluxers from settling in drill holes, UL approvals in acc. with UL File No. E80315, application by screen printing
ELPEPCB® Plugging Pastes
Securely seal via holes for vacuum adaptation during incircuit testing, prevent solder from seeping to the component side and fluxers from settling in drill holes, UL approvals in acc. with UL File No. E80315, application by screen printing
ELPEPCB® Plugging Pastes
Securely seal via holes for vacuum adaptation during incircuit testing, prevent solder from seeping to the component side and fluxers from settling in drill holes, UL approvals in acc. with UL File No. E80315, application by screen printing
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SD 2361 series
100% solids content means virtually no volume shrinkage
1-pack system
thixotropic adjustment for larger drill holes (approx. 0.5-1 mm)
Bubble-free, smooth hole filling/insulation layers in HDI/SBU technology, excellent metallisability, low thermal expansion coefficient, no cracking or delamination of the applied metallisation, UL approvals in acc. with UL File No. E80315
ELPEPCB® Via Filler
Bubble-free, smooth hole filling/insulation layers in HDI/SBU technology, excellent metallisability, low thermal expansion coefficient, no cracking or delamination of the applied metallisation, UL approvals in acc. with UL File No. E80315
ELPEPCB® Via Filler
Bubble-free, smooth hole filling/insulation layers in HDI/SBU technology, excellent metallisability, low thermal expansion coefficient, no cracking or delamination of the applied metallisation, UL approvals in acc. with UL File No. E80315
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PP 2795 series
Application by screen and stencil printing, vacuum plugging and roller coating
higher aspect ratios possible with high-viscosity adjustment
Exceptional covering power, very good adhesion, soldering resistant, high solids content
ELPEPCB® Marking inks
Exceptional covering power, very good adhesion, soldering resistant, high solids content
ELPEPCB® Marking inks
Exceptional covering power, very good adhesion, soldering resistant, high solids content
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Photoimageable Elpemer® marking inks
Blanket application by screen printing, especially suitable for pilot and low-volume series' as no complex screen stencil required, capable of representing finest details
SD 2691 TSW
Aqueous-alkaline developable
outstanding yellowing resistance even after reflow soldering and tempering processes, low ΔE values
to substitute gold on contact points, also suitable for cross-over technology and for generating printed resistors
ELPEPCB® Carbon-conductive inks
to substitute gold on contact points, also suitable for cross-over technology and for generating printed resistors
ELPEPCB® Carbon-conductive inks
to substitute gold on contact points, also suitable for cross-over technology and for generating printed resistors
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Carbon-conductive inks
High-definition application by screen printing, very good adhesion to flexible base material, thus also suitable for "static flex" applications, excellent mechanical resistance, resistant to Hot-Air Levelling
SD 2842 HAL
Ultra-smooth surface, thus also suitable for sliding contacts
Highly thermally conductive systems for the thermal management of pcbs/pcb assemblies, cost-effective alternative to conventional glued heatsinks, flexible design of different heatsink geometries with existing screen printing technology, electrically insulating
ELPEPCB® Thermal transfer pastes
Highly thermally conductive systems for the thermal management of pcbs/pcb assemblies, cost-effective alternative to conventional glued heatsinks, flexible design of different heatsink geometries with existing screen printing technology, electrically insulating
ELPEPCB® Thermal transfer pastes
Highly thermally conductive systems for the thermal management of pcbs/pcb assemblies, cost-effective alternative to conventional glued heatsinks, flexible design of different heatsink geometries with existing screen printing technology, electrically insulating
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Heatsink pastes
for heat transfer and heat dissipation
HSP 4 A
smoother surface enables good thermal connection in combination with TIP 2792
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